NewSUBARU synchrotron radiation facility

BL02 is a beamline for X-ray deep lithography with large work area. By using this line you can attain both fabrication processing with high aspect ratio and that with the accuracy below submicron level. This beamline has X-ray optical system which can select light energy from 2 to 12keV, and less than 2keV. According to the result of the fabrication by synchrotron lithography using newly developed X-ray masks, it has been successfully demonstrated processing of high aspect ratio at depth more than 2000μm with largest work area of A4 size, which is 15 times larger compared with conventional world top work area.

Schematic diagram of BL02

The main feature of this beamline is a structure that two beam lines of high energy passing (high passing) beam duct and energy efficient (low passing) beam duct accumulate in the vertical direction, high passing beam duct doesn't use mirror, and low passing beam duct has the structure with two mirrors. These two beam ducts are switched by the first mirror. When the high energy synchrotron radiation is needed to be used, the first mirror is excluded from the beam orbit, the X-ray beam obtained from the accumulation ring is introduced straight into the high energy passing beam duct, and the beam is led to the end station for X-ray lithography system. On the other hand, when the energy efficient synchrotron radiation is needed to be used, a high energy component is cut by two mirrors. The beam is bent downward by mirror, and to improve a parallel quality, the beam is focused by the second cylindrical mirror. The beam is led to the end station through the energy efficient passing beam duct. Moreover, according to equipped specification of mechanism of synchrotron radiation variable incidence angle for two-mirrors, the spectrum of the low energy synchrotron radiation can be controlled as the desired fabrication purpose.

Radiation spectrum at the beam energy of 1.5GeV

Radiation spectrum at the beam energy of 1.0GeV

Five axes control exposure chambers

The exposure system has a long span scanning-exposure equipment which provides multi-axial movable stage for three-dimensional microstructure processing. Five-axial stage enables the alignment of the relative position of substrate of photoresist and X-ray mask, tilt and rotation movements of these against synchrotron radiation are also possible with in-plane scannings. The movements of the exposure stage are automatically controlled by PC which is programed for speed, span of movement, repetition number etc beforehand.

Specfication of five axes stage

Example of fabrication