RF & DC SUPPATTERING SYSTEM.
　　　　　for mulilayer sputtering for EUV
　　　　Now, 66% or more of inflectance has been obtained with the 4 inches wafer.

　　ELECTRON  LITHOGRAPHY SYSTEM EQUIPMENT (Elionix, ELS-3700)
　　　　　for making thin films for EUV maltilayer.．
　　　　Patterning of Zone Plate or EUVL mask is advanced until now.

　　　RESIST  COATER  AND  DEVELOPMENT SYSTEM (Tokyo Electron, Clean Track Mark-8)
　　　　　for using of resist coater and development (for 8 inches wafer）　　　　　

　　DRY ETCHING SYSTEM. (Lam) (Lam Research, TCP 9400 SE Alliance(A6))
　　　　　for using to dry etching system.

　　　SCANNING ELECTRON MICROSCOPE（Hitachi, S-4500）
　　　　　for obsevation exposed pattern

　　　ATOMIC FORCE MICROSCOPE (Veeco, NanoScope III)
　　　　　for mesurement surface roughness of multilayer

　　　INTERFEROMETER  (ZYGO GPI XP)
　　　　　for adjustment optics and form evaluation of optical elements

　　 NON-COTACT FILM THICKNESS MEASUREMENT SYSTEM (Nano metrics, NanoSpec 6100)
　　　　　for measurement of the thickness of thin film on resist etc

　　　STYLUS  GAUSE        (Dektak3T) (Sloan, Dektak3 ST)

　　　FT  -  IR  (Parkin  Elmer, Spectrum One)